*Data last updated: 2026-04-28 22:07 (UTC+8)
As of 2026-04-28 22:07, Taiwan Semiconductor (TSM) is priced at $392,34, with a total market cap of $2,10T, a P/E ratio of 28,45, and a dividend yield of 0,90%. Today, the stock price fluctuated between $384,70 and $397,86. The current price is 1,98% above the day's low and 1,38% below the day's high, with a trading volume of 15,31M. Over the past 52 weeks, TSM has traded between $170,58 to $414,48, and the current price is -5,34% away from the 52-week high.
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Taiwan Semiconductor (TSM) Latest News
Decentralized Perpetual Exchange Sun Wukong Launches MU and TSM Futures with 10x Leverage
Gate News message, April 28 — Decentralized perpetual trading platform Sun Wukong has launched MU/USDT and TSM/USDT perpetual contracts, each with a maximum leverage of 10x, according to the platform's official social media announcement.
2026-04-28 00:51TSMC Accelerates Expansion at Double Pace, Five 2nm Fabs to Ramp Production in 2026
Gate News message, April 28 — Taiwan Semiconductor Manufacturing Company (TSMC) is accelerating its capacity expansion at double the historical pace to meet surging demand from artificial intelligence and high-performance computing, according to Hou Yongqing, senior vice president at TSMC. The company will simultaneously ramp production at five 2-nanometer fabs this year. As a result of this aggressive expansion, 2nm output in its first year is expected to increase approximately 45% compared to 3nm production during its equivalent ramp period.
2026-04-27 07:29Taiwan Court Sentences TSMC 2nm Trade Secret Leaker to 10 Years, Fines Tokyo Electron Subsidiary NT$150M
Gate News message, April 27 — Taiwan's Intellectual Property and Commercial Court has handed down a first-instance verdict in the TSMC 2nm process trade secret case. Chen Li-ming, a former employee of both TSMC and Tokyo Electron's Taiwan subsidiary, was sentenced to 10 years imprisonment, while Tokyo Electron's Taiwan subsidiary was fined NT$150 million. The court found that Chen joined Tokyo Electron's Taiwan subsidiary in a marketing role after leaving TSMC and solicited advanced process materials from TSMC engineers still employed there. The stolen information was used to help Tokyo Electron secure more equipment orders from TSMC. The compromised data included trade secrets related to etching equipment used in 2nm production, with some materials obtained through photography and duplication. Three other TSMC employees involved—Wu Bing-jun, Ge Yi-ping, and Chen Wei-jie—received sentences of 3 years, 2 years, and 6 years respectively. Tokyo Electron Taiwan subsidiary employee Lu Yi-yin was sentenced to 10 months with a 3-year probation. Tokyo Electron's NT$150 million fine can be suspended if the company compensates TSMC NT$100 million and pays NT$50 million to the public treasury.
2026-04-23 03:14TSMC Sticks with Existing EUV Tools, Delays High-NA Adoption; A13 Process Targeted for 2029
Gate News message, April 23 — TSMC unveiled new manufacturing and packaging technologies designed to make chips smaller and faster, while announcing it will continue using existing ASML EUV machines rather than adopting newer High-NA lithography tools. The company's A13 process is targeted to enter production in 2029, while N2U represents a lower-cost option for smartphone, laptop, and AI chips. By 2028, TSMC aims to package 10 large chips with 20 memory stacks, compared to Nvidia's Vera Rubin design which features two compute chips and eight memory stacks. The decision contrasts with competitors moving faster on High-NA technology. Intel has already installed ASML's Twinscan EXE:5200B High-NA system and expects risk production in 2027 with volume output in 2028. Samsung received its first High-NA scanner in late 2025 and a second in the first half of 2026, while SK Hynix installed a High-NA EUV tool in September 2025. TSMC's choice reflects cost and risk considerations rather than a full dismissal of High-NA EUV technology. Analysts noted that challenges including heat management, material expansion, and cracking remain unresolved. ASML maintains a near-monopoly in EUV systems, with ZEISS SMT, Lam Research, and Applied Materials positioned to benefit from the spending wave. Chinese chipmaker SMIC remains unable to purchase EUV tools under export restrictions.
2026-04-22 23:42TSMC Plans to Enable Advanced Packaging Facility in Arizona by 2029
Gate News message, April 22 — Taiwan Semiconductor Manufacturing Company (TSMC) plans to enable an advanced chip packaging facility in Arizona by 2029, according to Chang Hsiao-chiang, senior vice president of TSMC's global business and deputy co-chief operating officer. "We are actively expanding our capabilities within our Arizona facility. We plan to establish CoWoS and 3D-IC capabilities locally by 2029, which remains our target," Chang stated. CoWoS (Chip-on-Wafer-on-Substrate) is an advanced packaging technology that enables higher integration density, while 3D-IC (three-dimensional integrated circuits) allows for vertical stacking of chips to improve performance and reduce footprint.
